Teplo Frame Ties

Ancon L-5 and L-7 Teplo Frame Ties are leading the way in sustainable construction, offering industry-leading low thermal conductivity. These ties are designed specifically to minimize heat loss through thermal bridging, making them essential for energy-efficient buildings. Ideal for both new builds and retrofit projects, the Teplo-BFL-Tie range provides exceptional thermal performance, ensuring your masonry cavity walls maintain their energy efficiency without compromising on structural integrity.

Why Choose Ancon Teplo Frame Ties?

  • Low Thermal Conductivity: The L-5 and L-7 Teplo-BFL-Ties are engineered to reduce thermal bridging, improving the overall U-value of your building envelope.
  • Energy Efficiency: These ties help achieve sustainable, energy-efficient structures, making them ideal for modern, super-insulated building designs.
  • Versatile Applications: Suitable for use in a variety of wall types, including those with wide cavities, Teplo Frame Ties are perfect for new-build projects and energy retrofits.
  • Proven Performance: Backed by extensive testing and BBA approval, Ancon Teplo ties are trusted by industry professionals for reliable performance in all conditions.

Key Features:

  • Teplo-BFL-Tie L-5: Designed for use in cavities from 76mm to 400mm, these ties offer a balance of strength and thermal efficiency.
  • Teplo-BFL-Tie L-7: Ideal for even larger cavities, ensuring structural stability while maintaining low thermal conductivity.
  • Thermal Efficiency: With a thermal conductivity of less than 1.0W/mK, these ties are often excluded from U-value calculations, further enhancing energy efficiency.

Applications:

  • New Builds: Perfect for super-insulated building envelopes, ensuring minimal heat loss and superior energy efficiency.
  • Retrofit Projects: Ideal for improving the thermal performance of existing structures without extensive modifications.
  • Wide Cavity Walls: Specifically designed for use in buildings with wide cavity walls, maintaining stability without compromising on thermal performance.
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